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2025 연구성과별 연구자 정보 (36 / 1187)
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| Document Title | Author Full Name | Author Short Name | Index | Corresponding | Address | ResearcherID | ResearcherID Author Name | ORCID | ORCID Author Name | Related Email |
|---|---|---|---|---|---|---|---|---|---|---|
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Kim, Minseok | Kim, M | 2 | Kyungpook Natl Univ, Sch Elect Engn, Daegu 41566, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Kim, Keun-Tae | Kim, KT | 3 | Korea Univ, Coll Med, Dept Biomed Sci, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Kim, Keun-Tae | Kim, KT | 3 | Korea Univ, Coll Med, Dept Convergence Med, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Chou, Namsun | Chou, N | 4 | Korea Brain Res Inst KBRI, Emot Cognit & Behav Res Grp, Daegu, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Kim, Hong Nam | Kim, HN | 5 | Korea Inst Sci & Technol KIST, Brain Sci Inst, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Kim, Hong Nam | Kim, HN | 5 | Univ Sci & Technol UST, KIST Sch, Div Biomed Sci & Technol, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Kim, Hong Nam | Kim, HN | 5 | Yonsei Univ, Sch Mech Engn, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Kim, Hong Nam | Kim, HN | 5 | Yonsei Univ, Yonsei KIST Convergence Res Inst, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Cho, Il-Joo | Cho, IJ | 6 | Korea Univ, Coll Med, Dept Biomed Sci, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Cho, Il-Joo | Cho, IJ | 6 | Korea Univ, Coll Med, Dept Convergence Med, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Cho, Il-Joo | Cho, IJ | 6 | Korea Univ, Coll Med, Inst Human Genet, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | |||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Lee, Ju-Hyun | Lee, JH | 7 | 교신저자 | Korea Inst Sci & Technol KIST, Brain Sci Inst, Seoul, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | ||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Shin, Hyogeun | Shin, H | 8 | 교신저자 | Kyungpook Natl Univ, Sch Elect Engn, Daegu 41566, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | ||||
| A scalable 3D packaging technique for brain organoid arrays toward high-capacity bioprocessors | Shin, Hyogeun | Shin, H | 8 | 교신저자 | Kyungpook Natl Univ, Sch Elect & Elect Engn, Daegu, South Korea | juhyun.lee@kist.re.kr; hyogeunshin@knu.ac.kr; | ||||
| A Seamless Authentication Scheme for Edge-Assisted Internet of Vehicles Environments Using Chaotic Maps | Son, Seunghwan | Son, S | 1 | Kyungpook Natl Univ, Sch Elect & Elect Engn, Daegu 41566, South Korea | sonshawn@knu.ac.kr; kdk145@knu.ac.kr; parkyh@knu.ac.kr; |
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