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2022 연구성과별 연구자 정보 (1445 / 2879)
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| Document Title | Author Full Name | Author Short Name | Index | Corresponding | Address | ResearcherID | ResearcherID Author Name | ORCID | ORCID Author Name | Related Email |
|---|---|---|---|---|---|---|---|---|---|---|
| Implementation of a Geant4-based code using low-energy gamma-nuclear final state model for photonuclear studies | Thanh, K. T. | Thanh, KT | 5 | Acad Sci & Technol, Inst Phys, Ctr Nucl Phys, Hanoi, Vietnam | letuananh.nuclphys@gmail.com; | |||||
| Implementation of a Geant4-based code using low-energy gamma-nuclear final state model for photonuclear studies | Thanh, K. T. | Thanh, KT | 5 | Acad Sci & Technol, Inst Phys, Int Ctr Phys, Hanoi, Vietnam | letuananh.nuclphys@gmail.com; | |||||
| Implementation of antimicrobial stewardship programs | Kwon, Ki Tae | Kwon, KT | 1 | 교신저자 | Kyungpook Natl Univ, Sch Med, Dept Internal Med, Daegu, South Korea | 0000-0003-4666-0672 | Kwon, Ki Tae | ktkwon@knu.ac.kr; | ||
| Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications | Lee, Jongwon | Lee, J | 1 | 교신저자 | Natl Nanofab Ctr, Nano Convergence Technol Div, Daejeon 34141, South Korea | 0000-0002-9466-4013 | Lee, Jongwon | temuchin80@rmfc.re.kr;cheersssss@naver.com;jhsong@nnfc.re.kr;gssim@nnfc.re.kr;hhko@cnu.ac.kr;shkong@knu.ac.kr;temuchin80@nnfc.re.kr; | ||
| Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications | Lee, Jae Yong | Lee, JY | 2 | Kyungpook Natl Univ, Sch Elect & Elect Engn, Daegu 41566, South Korea | temuchin80@rmfc.re.kr;cheersssss@naver.com;jhsong@nnfc.re.kr;gssim@nnfc.re.kr;hhko@cnu.ac.kr;shkong@knu.ac.kr;temuchin80@nnfc.re.kr; | |||||
| Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications | Song, Jonghyun | Song, J | 3 | Natl Nanofab Ctr, Nano Convergence Technol Div, Daejeon 34141, South Korea | temuchin80@rmfc.re.kr;cheersssss@naver.com;jhsong@nnfc.re.kr;gssim@nnfc.re.kr;hhko@cnu.ac.kr;shkong@knu.ac.kr;temuchin80@nnfc.re.kr; | |||||
| Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications | Song, Jonghyun | Song, J | 3 | Chungnam Natl Univ, Dept Elect Engn, Daejeon 34134, South Korea | temuchin80@rmfc.re.kr;cheersssss@naver.com;jhsong@nnfc.re.kr;gssim@nnfc.re.kr;hhko@cnu.ac.kr;shkong@knu.ac.kr;temuchin80@nnfc.re.kr; | |||||
| Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications | Sim, Gapseop | Sim, G | 4 | Natl Nanofab Ctr, Nano Convergence Technol Div, Daejeon 34141, South Korea | temuchin80@rmfc.re.kr;cheersssss@naver.com;jhsong@nnfc.re.kr;gssim@nnfc.re.kr;hhko@cnu.ac.kr;shkong@knu.ac.kr;temuchin80@nnfc.re.kr; | |||||
| Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications | Ko, Hyoungho | Ko, H | 5 | 교신저자 | Chungnam Natl Univ, Dept Elect Engn, Daejeon 34134, South Korea | 0000-0001-5348-3585 | Ko, Hyoungho | temuchin80@rmfc.re.kr;cheersssss@naver.com;jhsong@nnfc.re.kr;gssim@nnfc.re.kr;hhko@cnu.ac.kr;shkong@knu.ac.kr;temuchin80@nnfc.re.kr; | ||
| Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications | Kong, Seong Ho | Kong, SH | 6 | 교신저자 | Kyungpook Natl Univ, Sch Elect & Elect Engn, Daegu 41566, South Korea | temuchin80@rmfc.re.kr;cheersssss@naver.com;jhsong@nnfc.re.kr;gssim@nnfc.re.kr;hhko@cnu.ac.kr;shkong@knu.ac.kr;temuchin80@nnfc.re.kr; | ||||
| Implementation of the LADM-Based Cadastral Model for Mongolia towards Transition to a 3D Cadastre | Buuveibaatar, Munkhbaatar | Buuveibaatar, M | 1 | Kyungpook Natl Univ, Res Inst Artificial Intelligent Diag Technol Multi, Sangju 37224, South Korea | ISU-9533-2023 | Buuveibaatar, Munkhbaatar | 0000-0002-1543-9580 | Buuveibaatar, Munkhbaatar | wlee33@knu.ac.kr; | |
| Implementation of the LADM-Based Cadastral Model for Mongolia towards Transition to a 3D Cadastre | Lee, Kangjae | Lee, KJ | 2 | Kyungpook Natl Univ, Dept Convergence & Fus Syst Engn, Sangju 37224, South Korea | 0000-0002-2857-6496 | Lee, Kangjae | wlee33@knu.ac.kr; | |||
| Implementation of the LADM-Based Cadastral Model for Mongolia towards Transition to a 3D Cadastre | Lee, Wonhee | Lee, W | 3 | 교신저자 | Kyungpook Natl Univ, Dept Convergence & Fus Syst Engn, Sangju 37224, South Korea | wlee33@knu.ac.kr; | ||||
| Implications of glial metabolic dysregulation in the pathophysiology of neurodegenerative diseases | Afridi, Ruqayya | Afridi, R | 1 | Kyungpook Natl Univ, Sch Med, Dept Pharmacol, Daegu 41944, South Korea | ksuk@knu.ac.kr; | |||||
| Implications of glial metabolic dysregulation in the pathophysiology of neurodegenerative diseases | Afridi, Ruqayya | Afridi, R | 1 | Kyungpook Natl Univ, Sch Med, Dept Biomed Sci, BK21 Plus KNU Biomed Convergence Program, Daegu 41944, South Korea | ksuk@knu.ac.kr; |
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